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ํšŒ์‚ฌ ๊ฐœ์š”

ํšŒ์‚ฌ ์•จ๋ฒ”

๊ธฐ๋ณธ ์ •๋ณด

์ œํ’ˆ ์šฉ๋Ÿ‰

์ƒ์‚ฐ ํ๋ฆ„

SD Card Wafer grinding / wafer cutting
iotech card Package Workflow: 1.Wafer grinding / wafer cutting 2. Wafer mount 3. lead bonding 4.plastic package 5.Laser cutting / forming & separating

์ƒ์‚ฐ ์žฅ๋น„

์ด๋ฆ„
์•„๋‹ˆ์š”
์ˆ˜๋Ÿ‰
๊ฒ€์ฆ๋จ
Wafer grinding / wafer cutting
TSK &Disco
6
Wafer mount
Hitachi DB700
4
lead bonding
K&S Iconn
8
plastic package
Towa Auto Mold Y-1
10
Laser cutting / forming & separating
HAMI / ASM
4
๊ฒ€์ฆ๋จ

๊ณต์žฅ ์ •๋ณด

๊ณต์žฅ ๊ทœ๋ชจ
3,000-5,000 square meters
๊ณต์žฅ ๊ตญ๊ฐ€/์ง€์—ญ
Longhua District,Shenzhen
์ƒ์‚ฐ ๋ผ์ธ ์ˆ˜
Above 10
๊ณ„์•ฝ ์ œ์กฐ
OEM Service Offered, Design Service Offered
์—ฐ๊ฐ„ ์ถœ๋ ฅ ๊ฐ’
US$50 Million - US$100 Million

์—ฐ๊ฐ„ ์ƒ์‚ฐ ๋Šฅ๋ ฅ

์ œํ’ˆ ์ด๋ฆ„
์ƒ์‚ฐ ์ˆ˜๋Ÿ‰
์—ญ๋Œ€ ์ตœ๊ณ 
์ƒํ’ˆ ์œ ํ˜•
๊ฒ€์ฆ๋จ
USB Flash Drives
2700000
Unit/Units
SD Card
1200000
Unit/Units
Micro SD Cards
1850000
Unit/Units
๊ฒ€์ฆ๋จ

์ƒ์‚ฐ ๋ผ์ธ

์ƒ์‚ฐ ๋ผ์ธ
๊ด€๋ฆฌ์ž
์šด์˜์ž ์ˆ˜
์ธ๋ผ์ธ QC/QA ์ˆ˜
๊ฒ€์ฆ๋จ
Dust-free plant
5
10
16
๊ฒ€์ฆ๋จ

ํ’ˆ์งˆ ๊ด€๋ฆฌ

ํ’ˆ์งˆ ๊ด€๋ฆฌ ์ ˆ์ฐจ

Bad Block Memory Test
Bad Block Memory Test: Pick out the memory cards wich have bad block.

์‹œํ—˜ ์žฅ๋น„

๊ธฐ๊ณ„ ์ด๋ฆ„
๋ธŒ๋žœ๋“œ ๋ฐ ๋ชจ๋ธ ๋ฒˆํ˜ธ
์ˆ˜๋Ÿ‰
๊ฒ€์ฆ๋จ
YH
H2Test
20
๊ฒ€์ฆ๋จ